FinFET Chip Woes: Low Yields Delay Galaxy S8 and More

Most of the upcoming flagship smartphones for the year are expected to incorporate chipsets manufactured through the 10nm process. Samsung is set to equip the Galaxy S8 and S8+ models with Qualcomm Snapdragon 835 and Exynos 8895 processors, both built using the 10nm fabrication process. While Samsung traditionally unveils its flagship S-series device at the Mobile World Congress (MWC), this year’s launch is postponed to the end of March, with the device expected to hit the market on April 21. Reported reasons for the delay include extended testing periods and slowdowns in the processor production process.

Sony’s Xperia XZ Premium is also set to utilize the Snapdragon 835 chipset and is slated for a late spring release. The exclusivity agreement between Samsung and Qualcomm for the Snapdragon 835 processor presents challenges for other manufacturers in securing the chipset. This situation led LG to opt for the Snapdragon 821 chipset in its G6 flagship device. Additionally, smartphones utilizing MediaTek’s Helio X30 processor, fabricated by TSMC, are expected to face delays in reaching the market, with releases projected for the second quarter.

While the report does not specify if the Samsung Galaxy S8 launch will be postponed, it does suggest that the manufacturing delays for smartphones featuring 10nm chipsets may cause a delay in their release dates later this year.

Explore the intricate world of FinFET chip manufacturing as low yields throw a wrench into the release schedule of highly anticipated devices like the Galaxy S8. Delve into the strategies being employed to overcome these setbacks and the ripple effects they may have on the tech landscape.

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